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Orbbec Gemini 330 Series Documentation
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Thermal
Orbbec Gemini 330 Series Documentation

Thermal

Update on 2025-07-25 10:24:55

1. Overview

This document provides the optimal reference thermal design solution for the camera, assisting customers in quickly implementing effective cooling strategies during product development and deployment.

2. Thermal Reference Solution for Gemini 335/336

  1. Active Cooling: It is recommended to use fans for active cooling.
    Operating temperature ranges:

     

    • LDM module: < 60°C
    • IR module: < 60°C
    • RGB module: < 60°C
    • Temperatures of all chips on the motherboard: < 70°C
  2. Passive cooling:
    • Apply graphite thermal pads on the side. It is recommended to use graphite thermal pads with specifications of 500W or higher.

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3. Thermal Reference Solution for Gemini 335L/336L

  1. Active Cooling: It is recommended to use fans for active cooling.
    Operating temperature ranges:

     

    • LDM module: < 60°C
    • IR module: < 60°C
    • RGB module: < 60°C
    • Temperatures of all chips on the motherboard: < 70°C
  2. Passive cooling:

a. Apply graphite thermal pads on the side. It is recommended to use graphite thermal pads with specifications of 500W or higher.

4. System Design Requirements

  1. Sealing Requirements
    • Use foam padding or silicone seals between the 3D camera and the customer’s device to prevent dust.
  2. Lens Requirements
    • No additional lenses or covers can be added to the front of the 3D camera.
  3. Cooling Requirements
    • Connect the 3D camera to external metal components using thermal conductive materials to expand the cooling area. It is recommended to incorporate active cooling with fans.
    • The 3D cameras must not be heated by other heat sources.
  4. Before customer tooling, please provide structural drawings related to the 3D camera for orbbec’s ME review.

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